Epoxy-Modified Silicone Resin
Silico® Epoxy-Modified Silicone Resin combines silicone’s heat resistance and weatherability with epoxy’s strong adhesion and chemical resistance. Ideal for high-temp coatings, electrical insulation, encapsulation, and structural adhesives in demanding applications.
Product Overview
Silico® Epoxy-Modified Silicone Resin is an advanced hybrid polymer engineered by chemically integrating epoxy functional groups into a polysiloxane backbone. This dual-phase structure combines the thermal stability, weather resistance, and hydrophobicity of silicone with the strong adhesion, chemical resistance, and mechanical performance of epoxy systems.
Designed for industrial applications requiring high heat resistance and substrate bonding, it is ideal for protective coatings, electrical insulation, encapsulation, and structural adhesives.Typical Technical Specifications
| Property | Typical Value |
|---|---|
| Appearance | Clear to pale yellow viscous liquid |
| Viscosity | 500–2000 mPa·s @ 25 °C (varies by grade) |
| Solids Content | 50–60% (customizable upon request) |
| Glass Transition Temp | ≥ 120 °C |
| Working Temp Range | –40 °C to +300 °C (up to 600 °C post-cure) |
| Compatibility | Organic solvents (toluene, xylene, alcohols), PDMS, epoxy resin blends |
Key Features & Benefits
Exceptional Heat & Oxidation Resistance
Stable in continuous temperatures up to 300 °C; post-cure withstands up to 600 °C (with fillers or reinforcement systems).Superior Adhesion & Corrosion Protection
Epoxy groups enhance chemical bonding to metals, glass, and ceramics, providing long-lasting protection in aggressive environments.Enhanced Film Toughness & Flexibility
The hybrid backbone reduces brittleness and improves impact resistance, outperforming conventional epoxy or silicone-only systems.Versatile Formulation Compatibility
Compatible with various solvents and reactive systems (e.g., melamine, polyols), suitable for both solvent-based and low-VOC coating designs.Electrical Insulation Properties
Offers excellent dielectric strength and moisture resistance for encapsulation and potting applications in electronics.
Common Applications
High-Temperature Anti-Corrosion Coatings
Ideal for pipelines, chemical tanks, and industrial metal substrates requiring long-term heat and corrosion resistance.Electronic Component Encapsulation
Provides insulation, moisture protection, and heat dissipation in circuit boards, transformers, and sensors.Structural & Metal Adhesives
Used in high-performance bonding of glass, metal, and composite materials in automotive, aerospace, and construction.Industrial Sealants & Insulating Varnishes
Enhances chemical resistance, mechanical strength, and weather stability in specialty sealant systems.
Related Grades from Silico® (Examples)
Silico® ER-6101 – Medium-viscosity grade for high-temp metal coatings
Silico® ER-480 – Fast-curing version for electrical varnishes and insulation
Silico® ER-CPX – Epoxy-silicone copolymer for solvent-free formulations
(Full product grade table available upon request.)
Packaging & Storage
Standard Packaging: 25 kg pail / 200 kg drum / IBC tote
Shelf Life: 12 months in original, unopened container at ≤25 °C
Storage Conditions: Cool, dry, well-ventilated area; avoid direct sunlight and moisture
Why Choose Silico® Epoxy Silicone Resins?
✅ Optimized for high-performance coatings and electronics
✅ Excellent thermal, chemical, and dielectric properties
✅ Available in various viscosities and solid contents
✅ Supported by full TDS, MSDS, and technical application guidance
✅ Customizable grades available on request
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