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Home » Product » Silicone Resins » Methyl Silicone Resin
Epoxy-Modified Methyl Silicone Resin
Epoxy-Modified Methyl Silicone Resin is a hybrid material combining the heat resistance and durability of silicone with the strong adhesion and reactivity of epoxy. It’s ideal for high-temp coatings, adhesives, electronic encapsulation, and composite materials.
Product Overview
Epoxy-Modified Methyl Silicone Resin is a high-performance hybrid material synthesized by incorporating epoxy functional groups into a methyl MQ silicone resin backbone. This modification combines the thermal stability, hydrophobicity, and weather resistance of traditional silicone resins with the reactivity, adhesion, and mechanical strength of epoxy systems.
It is widely used in applications requiring high-temperature resistance, chemical durability, and strong adhesion to substrates such as metal, glass, ceramic, and composites. The resin is particularly suited for protective coatings, adhesives, electronic encapsulants, and composite material systems.
Technical Specifications
| Property | Typical Value |
|---|---|
| Appearance | Clear to pale yellow transparent liquid |
| Solid Content | ~50 wt% |
| Viscosity (25 °C) | 100 – 10,000 cP (grade-specific) |
| Epoxy Equivalent Weight (EEW) | 500 – 2000 g/mol (customizable) |
| Refractive Index (25 °C) | ~1.410 – 1.440 |
| Density | 0.97 – 1.20 g/cm³ |
| Active Epoxy Content | 0.05 – 0.20 meq/g |
| Flash Point | >200 °C |
| Curing Method | Thermal, UV, or epoxy hardener (amine/anhydride) |
| Service Temperature Range | −60 °C to +300 °C |
Key Features & Benefits
Dual-Reactive Functionality
Combines epoxy reactivity for strong adhesion and crosslinking with the thermal and chemical resistance of silicone resin.Excellent Thermal and Weather Resistance
Ideal for use in outdoor or high-temperature environments, retaining stability under UV exposure, humidity, and oxidation.Superior Adhesion to Diverse Substrates
Epoxy groups enable strong chemical bonding to metals, ceramics, plastics, and glass, especially when used in hybrid formulations.High Dielectric Strength
Excellent electrical insulation makes it suitable for electronic coatings, PCB encapsulation, and insulation varnishes.Low VOC & Environmentally Friendly
Contains minimal volatile components, helping to meet stringent environmental regulations and green formulation standards.Versatile Formulation Compatibility
Can be blended with epoxy resins, phenolic resins, polyesters, and urethane systems for tailored mechanical and curing properties.
Applications
- High-Performance Coatings
Heat-resistant industrial coatings (up to 300°C)
Anti-corrosion and anti-graffiti coatings
Glass, ceramic, and metal protective layers
- High-Performance Coatings
- Advanced Adhesives & Sealants
High-adhesion structural bonding agents
Silicone-epoxy hybrid adhesives for composites
Automotive, marine, aerospace bonding applications
- Advanced Adhesives & Sealants
- Electronic Encapsulation & Insulation
Potting compounds for PCBs and electronic modules
High-voltage insulating coatings
Transformer varnishes and encapsulant systems
- Electronic Encapsulation & Insulation
- Thermoset Composites
- Blending with epoxy or phenolic systems.
- Molded parts with flame retardancy and high strength
- Reinforced fiber composites for electronics and aerospace
- Thermoset Composites
Packaging & Storage
- Packaging Options: 1 kg, 5 kg, 25 kg PE drums or customized IBC containers.
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Storage Conditions: Keep tightly sealed in a cool, dry place (5–25 °C), protected from light, heat, and moisture.
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Shelf Life: 6 months from date of manufacture in original unopened packaging.
Handling & Safety
Use appropriate PPE (gloves, goggles, protective clothing) during handling.
Ensure proper ventilation; avoid inhalation or direct skin contact.
Prevent contamination with strong acids, alkalis, or catalysts that may affect curing behavior.
Refer to the Material Safety Data Sheet (MSDS) for detailed information.
Jessica G.
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